Hybrid Thermal Modeling to Predict LED Thermal Behavior in Hybrid Electronics

Hybrid structural electronics (HSE) consists of printed electronics, conventional rigid and load-bearing supporting parts a device (plastic, glass etc.). Extra-large area flexible lighting elements with embedded light-emitting diodes (LEDs) are an example such applications. LEDs can be used, for example, as light sources, to create smart surfaces the architectural or automotive industry. Once into structure, they cannot replaced. To make sustainable HSE products long lifetime, new type designs is needed. The undergo conditions elevated thermal stresses while in operation. That known have impact on their performance thus making proper heat management LED crucial. Due novel additive manufacturing methods, structures, unconventional material combinations, many related aspects not known. In this study, two-step hybrid method, including modeling measurements, used estimate behavior surface-mounted polymer substrate HSE. model created simulated COMSOL Multiphysics. validity accuracy model's verified through measurements transient measurements. Based experimental verification, proposed simulation only has small (less than 2%) temperature variations when compared Hence, developed basis designing predicting characteristics different user cases.